StratEdge, a company specializing in high-performance semiconductor packages, announced its participation in the upcoming IMAPS Device Packaging Conference. This event, scheduled for March 19-20, 2024, in Fountain Hills, Arizona, will feature StratEdge’s latest developments in package manufacturing.
StratEdge will present its enhanced automated package assembly capabilities. The company’s upgraded facility now includes a programmable robot designed to automate repetitive tasks, thereby improving efficiency and precision in the manufacturing process. This advancement aims to offer cost-effective solutions while upholding high-quality standards.
At the conference, StratEdge is also set to highlight its molded ceramic semiconductor packages at Booth 60. These packages are engineered for high-reliability applications, serving a diverse range of markets including telecom, mixed signal, broadband wireless, satellite, defense, automotive, down-hole, and MEMS.
